ATP System-In-Package (SIP) flash product manufacturing process is the backbone to our superior build quality and durability. The industry leading SIP process involves advanced wire bonding, stacking, and encapsulation stages which make ATP products more consistently durable and reliable with waterproof, extreme temperature durability.
A technology driven company, ATP continues to expand its product portfolio with new unique products such as the SIP eUSB SSD, enabling newer applications for flash storage. ATP also continues to develop storage based technologies such as its X-Factor technology, allowing for the secure distribution of content on flash memory devices. The ATP X-Factor technology also includes features which allow for direct and secure access to the cloud services by using USB drive and memory card as a hardware key.
The ATP brand continues to grow through both consumer and industrial OEM sales channels. With multiple offices in the United States, Asia, and Europe, ATP offers worldwide support in both engineering and sales. ATP adheres to the strict ISO9001 QA standards for quality and compatibility. All ATP memory products are RoHs, CE, and FCC approved.
